pb lead-free parts LVYSBKS2692 ligitek electronics co.,ltd. property of ligitek only dual color led lamps data sheet doc. no : qw0905-LVYSBKS2692 rev. : a date : 27 - mar. - 2007
1.anode blue 2.common cathode 3.anode yellow sbks 1 23 vy 3.1 2.9 1 2 3 18.0min 0.5 typ 6.45 0.5 4.3 3.3 1.5 max 2.54typ 2.54typ 2.0min 2.0min page1/6 LVYSBKS2692 part no. 0 30 -30 60 75%100% 50% 25% 25% 50% 0 -60 100%75% package dimensions directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. ligitek electronics co.,ltd. property of ligitek only
page 2/6 unit ratings symbol parameter absolute maximum ratings at ta=25 ma ma 60 30 30 100 mw a 75 10 10 120 i fp i f forward current pd ir reverse current @5v power dissipation peak forward current duty 1/10@10khz vy sbks ligitek electronics co.,ltd. property of ligitek only -30 ~ +100 -20 ~ +80 tstg t opr operating temperature storage temperature luminous intensity @20ma(mcd) forward voltage @20ma(v) color typical electrical & optical characteristics (ta=25 ) typ. min. 60 220 120 min. typ. ---- 1.7 590 20 max. 2.6 475 26 4.29016060 3.5 ---- lens emitted white diffused yellow LVYSBKS2692 algainp ingan/sic blue note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. material part no viewing angle 2 1/2 (deg) dominant wave length dnm spectral halfwidth nm esd electrostatic discharge( * ) 2000 v 500 static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no.LVYSBKS2692
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600 0.0 0.5 1.0 1.52.02.53.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 typical electro-optical characteristics curve vy chip page3/6 part no.LVYSBKS2692
25 ambient temperature( ) fig.3 forward current vs. temperature 0 f o r w a r d c u r r e n t @ 2 0 m a 0 10 20 40 30 680 630 530 430 480 480 0 380 580 r e l a t i v e i n t e n s i t y @ 2 0 m a 100 5075 wavelength (nm) fig.4 relative intensity vs. wavelength 0.5 1.0 2 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve f o r w a r d c u r r e n t ( m a ) 1 0 5 10 15 30 25 20 sbk-s chip 1.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward current(ma) 5 4 3 05 forward voltage(v) 0 0.25 0.75 0.5 30 25 15 1020 fig.2 relative intensity vs. forward current 1.5 1.25 ligitek electronics co.,ltd. property of ligitek only page4/6 part no.LVYSBKS2692
page 5/6 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 150 time(sec) 260 c3sec max 260 temp( c) 2 /sec max 100 50 preheat 120 25 0 0 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 5 /sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 60 seconds max part no. LVYSBKS2692
the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solderability test 1.t.sol=230 5 2.dwell time=5 1sec mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 this test intended to see soldering well performed or not. thermal shock test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202:103b jis c 7021: b-11 the purpose of this test is the resistance of the device under tropical for hours. high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) mil-std-883:1008 jis c 7021: b-10 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. reliability test: test itemtest condition reference standard description ligitek electronics co.,ltd. property of ligitek only page6/6 part no.LVYSBKS2692
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